Rigid-Flex PCB Manufacturing for Compact, High-Reliability Systems

Custom rigid-flex circuits combine multilayer FR-4 sections with flexible polyimide interconnects to eliminate cables, reduce assembly space, and support reliable 3D packaging. XinshunPCB provides stackup review, bend-zone engineering, controlled impedance, and production support from prototypes to volume builds.

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Rigid-Flex PCB Specifications

Review construction parameters for rigid-flex builds together with the process and reliability window for rigid sections. Mass-production and extended-prototype limits are shown separately. Contact XinshunPCB to evaluate requirements beyond these ranges.

Rigid-flex construction

ParameterSpecification
Rigid-flex total layers2–32 layers
Flexible layers (within)1–12 layers
Rigid base materialFR-4 (High-Tg 150 / 170 available)
Flex base materialPolyimide (PI / Kapton), PET, PEN
CoverlayPolyimide coverlay on flex areas
StiffenersFR4, aluminum, polyimide, stainless steel
Finished thickness (rigid-flex)0.06–4.0 mm (0.0024″–0.16″)
Copper weightFlex 1/3 oz–2 oz · rigid heavy copper to 12 oz
Flex-section min trace / space0.5 oz: 4/4 mil · 1 oz: 5/5 mil · 2 oz: 5/7 mil

Lines, spacing & holes — rigid sections

ParameterMass productionPrototype (extended)
Min. inner-layer clearance3 mil3 mil
Min. line width3 mil (0.075 mm)3 mil (0.075 mm)
Min. line space3 mil (0.075 mm)3 mil (0.075 mm)
Min. hole size0.1 mm0.1 mm
Min. plated hole copper25 µm25 µm
Min. blind / buried via0.1 mm0.1 mm (1–18 layers)
PTH diameter tolerance±0.076 mm (±3 mil)±0.076 mm (±3 mil)
NPTH diameter tolerance±0.05 mm (±2 mil)±0.05 mm (±2 mil)
Hole position deviation±0.05 mm (±2 mil)±0.05 mm (±2 mil)

Copper, mask & legend

ParameterMass productionPrototype (extended)
Heavy copper (rigid)4 oz (140 µm)Up to 12 oz
Min. solder-mask bridge0.1 mm (4 mil)0.1 mm (4 mil)
Solder-mask colourGreen, Black, Blue, White, Yellow, RedGreen, Black, Blue, White, Yellow, Red
Silkscreen colourWhite, Yellow, Red, BlackWhite, Yellow, Red, Black
Peelable maskTop, bottom, double-sidedTop, bottom, double-sided

Surface finishes

ParameterSpecification
ENIGAvailable
ENEPIGAvailable
Immersion Silver / TinAvailable
OSPAvailable
Hard Gold / Gold fingersAvailable

Outline & mechanical

ParameterMass productionPrototype (extended)
Outline methodRouting, V-groove, beveling, punchRouting, V-groove, beveling, punch
Outline tolerance±0.15 mm (±6 mil)±0.15 mm (±6 mil)

Electrical & reliability

ParameterMass productionPrototype (extended)
Controlled impedance±10%±7%
Insulation resistance1 × 10¹² Ω (normal)1 × 10¹² Ω (normal)
Through-hole resistance< 300 Ω (normal)< 300 Ω (normal)
Thermal shock3 × 10 sec @ 288 ℃3 × 10 sec @ 288 ℃
Warp & twist≤ 0.7%≤ 0.7%
Electric strength> 1.3 kV/mm> 1.4 kV/mm
Peel strength1.4 N/mm1.4 N/mm
Solder-mask abrasion> 6H> 6H
Flammability94V-094V-0
Test voltage50–330 V50–330 V

Have a Rigid-Flex Board to Build?

Send your Gerbers, layer drawing, and bend requirements — XinshunPCB engineers will confirm manufacturability against this specification and reply with a quote, usually within 24 hours, plus a free DFM review.

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Advanced & High-End Rigid-Flex Processes

Constructions for tight folds, high layer counts, and demanding reliability requirements.

Multilayer Rigid-Flex

Multiple rigid sub-stacks linked by one or more flex layers, integrating a complete system into a single folding board.

2–32 layers

Book-Binding & Air-Gap

Loose-leaf, book-binding, and unbonded air-gap flex layers support a smaller bend radius and longer flex life.

Tight folds

HDI in Rigid Sections

Laser microvias, stacked or staggered vias, and fine lines in the rigid areas support dense component fan-out.

Microvia

Controlled Impedance

Impedance control is maintained across rigid-to-flex transitions with stackup design and TDR verification.

To ±7%

EMI Shielding Film

Conductive shielding film over flex areas supports noise-sensitive, high-frequency, and medical designs.

Shielded flex

Stiffeners & ZIF

Selective stiffeners and bevelled gold ZIF or contact fingers reinforce connector and component areas.

FR4 · PI · steel

Standards We Build & Test To

Rigid-flex spans two worlds, so we build flex and rigid-flex construction to IPC-6013 / IPC-2223 and rigid sections to IPC-6012 — all under one quality system.

IPC-6013

Flex & rigid-flex

IPC-2223

Flex design specification

IPC-6012

Rigid sections

IPC-A-600

Board acceptability

IPC-A-610

Assembly Class 2/3

ISO 9001

Quality management

UL · 94V-0

Listed

RoHS / REACH

EU compliant

ISO 13485

Medical-capable

IATF / AS9100

Auto & aerospace capable

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Rigid-Flex PCB Manufacturing FAQs

Find practical answers about rigid-flex construction, layer counts, material selection, bend requirements, inspection, and the files needed for a Rigid-Flex PCB quotation.

Q1 What is a rigid-flex PCB and when should it be used? +
A rigid-flex PCB combines rigid FR-4 sections and flexible circuit sections in one interconnected assembly. It can replace cables and board-to-board connectors, reduce assembly space and weight, and support three-dimensional packaging. It is commonly considered when compact routing, vibration resistance, repeated assembly handling, or reliable interconnection between multiple rigid sections is required.
Q2 How many layers can a rigid-flex PCB include? +
XinshunPCB supports rigid-flex constructions from 2 to 32 total layers, with 1 to 12 flexible layers within the stackup. The practical layer structure depends on the number of rigid and flex zones, material thickness, via design, bend requirements, impedance targets, and finished-board thickness, so the complete stackup should be reviewed before production.
Q3 What materials are commonly used in rigid-flex construction? +
Rigid sections commonly use FR-4, including high-Tg options, while flexible sections typically use polyimide film with copper and polyimide coverlay. Depending on the design, no-flow prepreg, adhesiveless laminate, EMI shielding film, and local stiffeners made from FR4, polyimide, aluminum, or stainless steel may also be specified.
Q4 How should bend areas be designed in a rigid-flex PCB? +
Define each bend location, direction, radius, and whether it is folded only during installation or moves repeatedly in service. Keep vias, pads, sharp trace corners, and abrupt copper transitions away from critical bend zones where possible. Trace routing, copper type, layer count, coverlay, and the rigid-to-flex transition should be reviewed together rather than applying one bend-radius rule to every construction.
Q5 What inspection and testing should be specified for rigid-flex PCBs? +
Inspection requirements should be agreed before production and may include dimensional checks, continuity and isolation testing, coverlay and rigid-to-flex registration, microsection analysis, X-ray inspection, controlled-impedance measurement, and bend or flex testing. Specify the test method, conditions, fixtures, and acceptance criteria when special reliability verification is required.
Q6 What files are needed for a rigid-flex PCB quotation and manufacturing review? +
Provide Gerber or ODB++ data, drill files, the proposed stackup, fabrication notes, and required quantities. Include a mechanical or layer drawing that clearly identifies rigid zones, flex zones, bend locations and direction, stiffeners, coverlay openings, surface finish, controlled-impedance requirements, and any special inspection or flex-cycle criteria. For assembly, also include the BOM, placement data, and assembly drawings.

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