HDI & any-layer
Laser-drilled microvias, stacked & staggered vias and sequential lamination for dense, high-pin-count designs.
Blind/buried to 18+ layers
Rigid PCB capabilities
High-precision multilayer rigid PCB fabrication for industrial, power, RF, automotive, and communication electronics.
Get Instant Rigid PCB QuoteRigid PCB specifications
Two capability tiers — Mass Production for repeatable, high-yield volume, and an extended Prototype window for pushing the limits. Need something beyond these? Ask us — we build to spec.
Layers & dimensions
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Layer count | 1–24 layers | 1–78 layers |
| Max. panel size | 600 × 770 mm (23.62″ × 30.31″) | 600 × 770 mm & 500 × 1200 mm (19.69″ × 47.24″) |
| Max. board thickness | 8.5 mm | 8.5 mm |
| Min. board thickness | 2L: 0.3 mm · 4L: 0.4 mm · 6L: 0.8 mm | 2L: 0.1 mm · 4L: 0.3 mm · 6L: 0.6 mm |
Lines & spacing
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. inner-layer clearance | 3 mil | 3 mil |
| Min. line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
Holes & vias
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. hole size | 0.1 mm | 0.1 mm |
| Min. plated hole copper | 25 µm | 25 µm |
| Min. blind / buried via | 0.1 mm | 0.1 mm (1–18 layers) |
| PTH dia. tolerance | ±0.076 mm (±3 mil) | ±0.076 mm (±3 mil) |
| NPTH dia. tolerance | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Hole position deviation | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
Copper, solder mask & legend
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Heavy copper | 4 oz (140 µm) | up to 12 oz |
| Min. solder-mask bridge | 0.1 mm (4 mil) | 0.1 mm (4 mil) |
| Solder-mask colour | Green, Black, Blue, White, Yellow, Red | Green, Black, Blue, White, Yellow, Red |
| Silkscreen colour | White, Yellow, Red, Black | White, Yellow, Red, Black |
| Peelable mask | Top, bottom, double-sided | Top, bottom, double-sided |
Outline & mechanical
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Outline method | Routing, V-groove, beveling, punch | Routing, V-groove, beveling, punch |
| Outline tolerance | ±0.15 mm (±6 mil) | ±0.15 mm (±6 mil) |
| Electrical & reliability | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | ±10% | ±7% |
| Insulation resistance | 1 × 10¹² Ω (normal) | 1 × 10¹² Ω (normal) |
| Through-hole resistance | < 300 Ω (normal) | < 300 Ω (normal) |
| Thermal shock | 3 × 10 sec @ 288 ℃ | 3 × 10 sec @ 288 ℃ |
| Warp & twist | ≤ 0.7% | ≤ 0.7% |
| Electric strength | > 1.3 kV/mm | > 1.4 kV/mm |
| Peel strength | 1.4 N/mm | 1.4 N/mm |
| Solder-mask abrasion | > 6H | > 6H |
| Flammability | 94V-0 | 94V-0 |
| Test voltage | 50–330 V | 50–330 V |
Have a rigid board to build?
Send your Gerbers and stackup - our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.
Request a QuoteAdvanced & high-end rigid processes
When your design pushes the envelope, our advanced process toolkit keeps it manufacturable and reliable.
Heavy copper
High-current and thermal designs with thick inner and outer copper, mixed with fine-line layers.
Up to 12 oz
Controlled impedance
Single-ended and differential impedance with stackup design support and TDR verification.
Tolerance to ±7%
Back drilling
Removal of via stubs for clean high-speed signal paths in thick multilayer boards.
High-speed designs
Via-in-pad & filling
Resin- or copper-filled, capped and planarized vias for fine-pitch BGA fan-out.
Plugged & plated over
Edge & half-hole plating
Castellated / half-plated holes and plated edges for board-to-board and module mounting.
CastellationStandards we build & test to
Every board is fabricated, inspected and documented to recognized industry standards.
IPC-6012
Rigid board - Class 2 & 3
IPC-A-600
Acceptability of boards
ISO 9001
Quality management
UL
Listed 94V-0
RoHS / REACH
EU compliant
Traceability
Lot & date control
J-STD-001
Soldering-ready
ISO 13485
Medical-capable
IATF 16949
Automotive-capable
AS9100
Aerospace-capable
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Explore SolutionCapabilities & Manufacturing Limits FAQ
Select the FAQs that should appear below this capability page.
Q1 What stiffener information is needed for a flex PCB quotation? + -
Provide the reinforcement material, outline, attachment side, placement tolerances, adhesive requirements and finished local thickness where critical. Include connector drawings, access holes, bend zones, assembly conditions, inspection requirements and revision-controlled fabrication data. Identify any material substitutions that need approval.
Q2 Does adding an FR-4 stiffener make a flex PCB a rigid-flex PCB? + -
No. A bonded mechanical FR-4 reinforcement does not by itself add a routed electrical layer. Rigid-flex construction integrates rigid and flexible regions into the electrical circuit build. Describe the actual stackup and interconnection requirements when requesting a quote so the supplier selects the correct manufacturing route.
Q3 Can a flexible PCB bend at the edge of its stiffener? + -
Do not make the stiffener edge the intended fold or repeated-bend line without an engineering review. The edge is a local stiffness transition. Define a free flex zone, review coverlay and reinforcement terminations together, and confirm the bend arrangement and any required qualification test for the complete construction.
Q4 How do I choose stiffener thickness for a ZIF connector? + -
Use the exact connector part number and current drawing to define the finished insertion thickness and tolerance. Account for every layer present in the contact region, including the flex construction, bonding layer and reinforcement. Specify the contact side and measurement location, and agree on a fit check when needed.
Q5 Should I use polyimide or FR-4 for a flex PCB stiffener? + -
Polyimide film is often considered for thin local thickness build-up, including connector tails. FR-4 is commonly considered where a more rigid support area is needed. Choose against the finished mechanical requirements, connector drawing and assembly process. The materials are not automatic substitutes for one another.
Q6 What is the purpose of a flex PCB stiffener? + -
A flex PCB stiffener adds local mechanical support or thickness to a flexible circuit. It can support component assembly, reinforce a mounting region or help a connector tail meet its finished insertion-thickness requirement. Specify the material, bonding layer, outline and attachment side for the intended function.
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