XinshunPCB Frequently Asked Questions

We support a broad multilayer range for production PCB jobs, including dense stackups for high-speed, high-reliability, and mixed-signal designs.

We handle standard copper as well as heavy-copper structures for power boards, with the exact stackup tuned to current load and thermal requirements.

We use controlled stackup planning and process control to keep impedance within the target window for high-speed and RF PCB projects.

Common finish options include HASL, ENIG, ENEPIG, OSP, immersion silver, and other finishes selected around solderability, reliability, and cost.

Our SMT process supports fine-pitch placement for compact assemblies, including small passives and dense BGA-style packages where the design is ready for production.

Yes. We support HDI builds, via-in-pad structures, and microvia designs when the stackup and fabrication rules are defined early.

Rigid-flex PCB projects are supported from fabrication through assembly, with attention to bend areas, layer alignment, and connector stress control.

Typical checks include SPI, AOI, X-ray where needed, ICT, functional test, and final visual inspection before shipment.

Yes. XinshunPCB supports SMT, through-hole, and mixed-technology assembly for both prototypes and volume programs.