Create routing space for fine-pitch components with high-density interconnect PCBs. XinshunPCB helps align microvias, layer stackups, materials, and assembly requirements for your design, from prototypes to production.
Custom HDI PCBs for Dense, Compact Electronics
Create routing space for fine-pitch components with high-density interconnect PCBs. XinshunPCB helps align microvias, layer stackups, materials, and assembly requirements for your design, from prototypes to production.
Plan fine-pitch routing and layer connections around your component layout, board size, and signal requirements.
HDI PCBs use fine circuit features and small interlayer connections to route complex designs within limited board space. XinshunPCB reviews your component layout, microvia map, build-up structure, and material requirements together to help prepare a manufacturable construction for your product.
Browse selected HDI PCB builds and review their materials, construction, and application details. Use these examples to discuss routing density, layer connections, and assembly needs for your project with XinshunPCB.
Review HDI structures, microvias, and fabrication parameters for your next design. Values below are planning references; the available combination of layer count, copper weight, hole geometry, and tolerances must be confirmed by XinshunPCB during DFM review before ordering.
| Parameter | Specification |
|---|---|
| HDI structures | 1+N+1, 2+N+2, 3+N+3; any-layer subject to review |
| Laser microvia diameter | 0.1 mm (4 mil); finer features require review |
| Microvia capture pad | Design reference: from approximately 0.25 mm |
| Microvia types | Stacked, staggered, and skip vias |
| Via fill | Copper-filled; resin-filled, capped, and planarized (VIPPO) |
| Build-up | Sequential lamination; multiple build-up layers |
| Minimum blind / buried via | Design reference: 0.1 mm within 1–18 layers |
| Through-hole aspect ratio | Design reference: up to approximately 10:1 |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Minimum inner-layer clearance | 3 mil | 3 mil |
| Minimum line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Minimum line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Minimum mechanical hole | 0.1 mm | 0.1 mm |
| Minimum plated hole copper | 25 µm | 25 µm |
| PTH diameter tolerance | ±0.076 mm (±3 mil) | ±0.076 mm (±3 mil) |
| NPTH diameter tolerance | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Hole position deviation | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
Combine microvia structures, fine-line routing, and controlled stackups to support miniaturization and high-speed performance. The final process route is reviewed against your design and qualification requirements.
Connections between successive layers can shorten escape routes and free routing space around high-pin-count devices. Select an any-layer structure after reviewing density, layer transitions, and reliability requirements.
Any-layer interconnect
Copper-filled laser microvias can be arranged in stacked or staggered patterns. Match the arrangement to the layer transitions, available pad area, and agreed qualification plan.
Copper-filled microvias
Filled, capped, and planarized vias allow routing connections within component pads. Define the filling and plating requirements to support fine-pitch BGA assembly.
Filled & plated over
Successive build-up and lamination stages connect outer routing layers to the core. Review 1+N+1, 2+N+2, and more complex structures against the required routing density.
HDI build-up
Fine trace geometries help route dense component areas. Select copper thickness and the appropriate imaging and etching process; advanced mSAP requirements need a separate process review.
Fine-pitch routing
Coordinate dielectric materials, trace geometry, and reference planes across the HDI stackup. Define impedance targets and test coupons before releasing the design.
Signal integrityRigid, flex, rigid-flex, HDI, metal-core, and SMT production lines cover a broad range of PCB and PCBA needs.
Custom PCB fabrication and assembly for wearables, smart-home devices, wireless audio and portable electronics. XinshunPCB supports design review, component sourcing and project-specific inspection from prototype to production.
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Explore SolutionsFind answers about choosing HDI construction, preparing design files, planning microvias and stackups, and moving from prototype evaluation to production.
Request a prototype build with the intended materials, stackup, and via structure where practical. Use it to evaluate assembly, electrical operation, and fit in the product. Agree the inspection records and any additional reliability or impedance testing before the build. Document the results and release an approved file revision for the next order; production quantities, material availability, and timing are confirmed for each project.
Explore articles on microvias, fine-pitch routing, stackups, assembly, and inspection to help prepare your high-density PCB project for production.
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