4L Multilayer Hybrid Metal-Core PCB (FR-4 Multilayer on Aluminum Base)
- Layer Count: 4 Layers (Multilayer FR-4 on Aluminum Base)
- Base Material: 4-Layer High-TG FR-4 Multilayer Stack + 1.5 mm Aluminum Base Substrate (Thermally Bonded)
- Application: Industrial variable-frequency drives (VFD), telecommunications RF base station power amplifiers, smart power grid switches, and avionics motor actuators.


