Build custom PCB assemblies with turnkey, consigned or partial component sourcing. Coordinate SMT and through-hole assembly, programming, inspection and agreed testing for prototypes and repeat production. Share your BOM, placement data and build requirements for a project-specific quote.
Turnkey SMT Assembly Services for Custom PCBA
Build custom PCB assemblies with turnkey, consigned or partial component sourcing. Coordinate SMT and through-hole assembly, programming, inspection and agreed testing for prototypes and repeat production. Share your BOM, placement data and build requirements for a project-specific quote.
Plan component sourcing, board preparation, soldering, and inspection around your design, quantities, and delivery requirements.
XinshunPCB supports custom surface-mount and mixed-technology PCB assemblies. Choose turnkey, consigned or partial component sourcing and define inspection, programming and functional test coverage around your project. Prepare the released BOM, placement data, fabrication files and test requirements before requesting a build.
Explore PCB assembly examples and discuss a build matched to your circuit, component packages, and application. Specify sourcing preferences, board quantities, programming, and test requirements so XinshunPCB can review the complete assembly scope.
Review the assembly planning parameters below for component placement, board handling, soldering, and testing. Listed process limits and specialist options are reference targets; availability, inspection coverage, and acceptance criteria are confirmed by XinshunPCB after reviewing your design and BOM.
| Parameter | Capability / Review Target |
|---|---|
| Single- and double-sided assembly | SMT and through-hole; large parts and BGAs on either side, subject to process review |
| Smallest component | 01005 target; 0201 standard reference |
| BGA / micro-BGA pitch | Down to 0.2 mm (0.008 in); packages above 1,000 balls require review |
| IC / leaded-component pitch | Down to 0.2 mm (0.008 in) |
| Placement accuracy | ±0.025 mm reference target |
| Machine-placed component size | Up to 2.2 × 2.2 × 0.6 in |
| Advanced packages | BGA, micro-BGA, CSP, QFN, LGA; flip-chip and PoP up to 3 tiers subject to feasibility review |
| Other components | LEDs, resistor/capacitor networks, electrolytics, potentiometers, sockets, and SMT connectors |
| Parameter | Capability / Review Target |
|---|---|
| Board dimensions | 0.5 × 0.5 in to 24 × 24 in; confirm large-format tooling |
| Board thickness | 0.010–0.250 in (0.25–6.35 mm) |
| Board layer count | Single-sided through 40+ layers; assembly feasibility reviewed separately |
| Outline and panelization | Custom outlines; tab routing, breakaway tabs, V-scoring, or combined routing and V-scoring |
| Board materials | FR-4 / high-Tg, polyimide / flex, aluminum or copper metal-core, Rogers, and rigid-flex |
| Surface finishes | HASL / SMOBC, ENIG, ENEPIG, immersion silver or tin, electrolytic or electroless gold, and OSP |
| Fiducials | Preferred; designs without fiducials require alignment review |
Plan fine-pitch placement, board support, protective treatments, and testing around your assembly requirements. Specialist processes and package limits are evaluated during engineering review.
Plan stencil apertures, pad geometry, solder volume, and reflow profiles for BGA, QFN, LGA, and other dense packages. Very fine pitch, flip-chip, and stacked packages require a package-specific feasibility review.
Package review
Review panel dimensions, component height, support tooling, and reflow sequence for large boards and assemblies populated on both sides. Confirm handling limits before panelization.
Board support
Select protective treatments around the operating environment, masking areas, connectors, and rework needs. Coating chemistry, thickness, and any specialist nano-coating process are agreed during review.
Environmental protection
Evaluate underfill or encapsulation for assemblies exposed to vibration, shock, or thermal cycling. Material compatibility, curing, inspection access, and repairability determine the suitable process.
Mechanical protection
Match ICT, flying-probe, boundary-scan, and functional checks to test access and fault coverage. Define fixtures, firmware, limits, and reporting before production begins.
ICT / FCT
Coordinate PCB assemblies with cables, connectors, enclosures, and final system checks. Specify mechanical drawings, programming, labeling, and packing requirements in the build package.
System integrationRigid, flex, rigid-flex, HDI, metal-core, and SMT production lines cover a broad range of PCB and PCBA needs.
Custom PCB fabrication and assembly for wearables, smart-home devices, wireless audio and portable electronics. XinshunPCB supports design review, component sourcing and project-specific inspection from prototype to production.
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High-power BMS, energy storage, and industrial control solutions engineered with heavy copper, high-voltage creepage control, and high-TG materials.
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High-frequency PCB and PCBA solutions for RF, 5G, networking, and connected devices.
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Medical-grade PCB and PCBA solutions built for traceability, reliability, and strict quality control.
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Automotive PCB and PCBA solutions designed for vibration, thermal cycling, and long-life reliability.
Explore SolutionsPractical answers to help you prepare an SMT assembly order, choose a sourcing model, define inspection and testing, and move from prototypes to repeat production.
Specify whether you need turnkey component sourcing, a fully consigned kit, or a combination of purchased and customer-supplied parts. Identify the sourcing responsibility for each BOM line and provide packaging, quantity, and condition details for supplied components. XinshunPCB reviews availability, approved substitutions, kit completeness, and any additional parts needed for setup before confirming the build.
Explore practical guides to BOM preparation, component placement, soldering processes, and inspection planning for custom PCB assemblies.
Have a new project or custom PCB requirements? Simply fill in your project details below. XINSHUNPCB's FAE engineering team will analyze your specifications and deliver a detailed formal quotation along with free engineering advice within 2-24 hours.
Detailed formal quote & lead time provided within 2-24 hours.
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