Flex PCB Manufacturing for Compact, Flexible Designs

Custom flexible circuits for wearables, medical devices, camera modules, and compact interconnects. XinshunPCB supports polyimide material selection, bend-area planning, and connector stiffeners to match your design and assembly requirements.

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Flex PCB Specifications

Explore construction options, materials, dimensions, circuit features, surface finishes, and test parameters for flexible circuits. Rigid-flex layer counts and thicknesses are listed separately where applicable. Contact us to review the requirements of your specific design.

Construction & materials

Parameter Specification
Layers — flexible 1–12 layers
Layers — rigid-flex 2–32 layers
Base material PI, PET, PEN, FR-4, DuPont (Kapton)
Stiffeners FR4, aluminum, polyimide, stainless steel
Copper thickness 1/3 oz – 2 oz

Dimensions & thickness

Parameter Specification
Max / min board size Min 0.2″ × 0.3″  ·  Max 20.5″ × 13″ (≈ 520 × 330 mm)
Final thickness — flexible 0.002″ – 0.1″  (0.05 – 2.5 mm)
Final thickness — rigid-flex 0.0024″ – 0.16″  (0.06 – 4.0 mm)
Insulation thickness 0.5 – 2 mil  (12.7 – 50 µm)

Lines, spacing & holes

Parameter Specification
Min. trace width / space 0.5 oz: 4/4 mil  ·  1 oz: 5/5 mil  ·  2 oz: 5/7 mil
Min. annular ring 0.5 oz: 4 mil  ·  1 oz: 5 mil  ·  2 oz: 7 mil
Min. hole size 8 mil
Hole tolerance PTH ±3 mil  ·  NPTH ±2 mil
Min. slot 24 × 35 mil  (0.6 × 0.9 mm)

Coverlay, mask & legend

Parameter Specification
Solder-mask / coverlay alignment tol. ±3 mil
Silkscreen alignment tol. ±6 mil
Silkscreen line width 5 mil

Surface finishes (lead-free)

Finish Specification
Immersion Nickel / Gold (ENIG) Nickel 100–200 µin  ·  Gold 1–5 µin
Gold plating (electrolytic) Nickel 100–200 µin  ·  Gold 1–4 µin
Immersion Silver Silver 6–12 µin
Immersion Tin Available
OSP Film 8–20 µin

Outline & test

Parameter Specification
Profile tolerance — accurate / ordinary mould Accurate mould ±2 mil · Ordinary mould ±4 mil
Profile tolerance — knife mould / hand-cut Knife mould ±8 mil · Hand-cut ±15 mil
Test voltage Testing fixture: 50–300 V

Have a flex or rigid-flex board to build?

Send your Gerbers, stackup and bend requirements — our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.

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Advanced & high-end flex processes

From simple single-layer flex to complex rigid-flex assemblies that bend, shield and survive millions of cycles.

Rigid-flex integration

Rigid sections and flexible tails in one board — eliminating connectors, saving space and boosting reliability.

2–32 layers

Multilayer & HDI flex

Multilayer flex with laser microvias and fine lines for dense, high-pin-count flexible interconnects.

Microvia

Dynamic flexing

Bend-to-install or continuous-flex designs engineered with rolled-annealed copper and optimized bend radius.

Millions of cycles

EMI shielding film

Conductive shielding film over flex circuits for noise-sensitive and high-frequency applications.

Shielded flex

Stiffeners & ZIF contacts

Selective stiffeners and bevelled gold ZIF / contact fingers for connector insertion and component areas.

FR4 · PI · steel

Controlled impedance

Impedance-controlled flex and rigid-flex with stackup design support and TDR verification.

Microstrip / stripline

Standards we build & test to

Every flexible and rigid-flex board is fabricated, inspected and documented to the relevant industry standards.

IPC-6013

Flex & rigid-flex

IPC-2223

Flex design spec

IPC-A-600

Board acceptability

IPC-A-610

Assembly Class 2/3

ISO 9001

Quality management

UL

Listed · 94V-0

RoHS / REACH

EU compliant

ISO 13485

Medical-capable

IATF 16949

Automotive-capable

AS9100

Aerospace-capable

Related Solutions

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Industrial & Power Electronics

Industrial & Power Electronics

Engineered to withstand massive electrical currents, thermal stress, and continuous mechanical vibration. XinshunPCB delivers IPC Class 3 heavy copper boards, high-thermal metal-core solutions, and turnkey SMT assemblies for grid-scale energy storage, industrial robotics, motor drives, and solar inverters.

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Telecommunications & IoT

Telecommunications & IoT

From wireless gateways and connected sensors to networking equipment, XinshunPCB supports custom PCB fabrication and assembly for communication hardware. Align materials, stackups, compact layouts, and production testing with your application, from initial prototypes to repeat production.

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Medical Equipment

Medical Equipment

From patient monitoring and diagnostic instruments to medical imaging systems, XinshunPCB provides custom PCB fabrication and PCBA assembly for healthcare equipment. We help you align board materials, circuit layouts, and assembly requirements with your application, supporting development from initial prototypes to production.

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Automotive Electronic

Automotive Electronic

Engineered to withstand extreme mechanical shock, high-voltage switching surges, and thermal cycling from –40°C to +150°C. XinshunPCB delivers IATF 16949-aligned, IPC-A-610 Class 3 turnkey PCB fabrication and SMT assembly for electric vehicle (EV) powertrains, ADAS sensing, high-voltage BMS, and under-hood body control modules.

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Flex PCB Manufacturing FAQs

Find practical answers about flexible circuit materials, bending requirements, stiffeners, coverlay, inspection, and the files needed for a Flex PCB quotation.

Q1 How do I choose materials for a Flex PCB? +
Material selection should consider operating temperature, assembly processes, flexibility, and cost. Polyimide is a common choice, while other films may suit specific applications. Review the base film, adhesive system, copper type, and total stackup together, and identify whether the circuit will bend only during installation or repeatedly during use.
Q2 What bend requirements should I specify for a flexible circuit? +
State whether the design is bend-to-install or intended for repeated movement. Provide the bend location, available radius, direction of motion, expected number of cycles, and operating environment. Bend suitability depends on the complete construction and routing, so a single minimum radius or cycle rating should not be assumed for every Flex PCB.
Q3 When does a Flex PCB need stiffeners or reinforced connector areas? +
Stiffeners provide local support where connectors, components, or mounting features need additional rigidity. For ZIF contacts, the finished insertion thickness should match the connector specification. Supply the stiffener material, thickness, outline, and attachment requirements, and keep the intended bend region clearly defined in the mechanical drawing.
Q4 How should coverlay and exposed contact areas be defined? +
Show coverlay openings, solderable pads, contact fingers, and any areas that must remain exposed in the fabrication data. Include alignment requirements and the intended surface finish. Coverlay, solder mask, and shielding layers serve different purposes, so their materials and coverage should be identified separately and reviewed with the stackup.
Q5 What inspection and testing should be specified for Flex PCBs? +
Agree acceptance requirements before production. Depending on the design, checks may cover dimensions, continuity and isolation, coverlay alignment, and finished thickness at connector areas. If impedance measurements or bend testing are required, specify the test method, fixtures, conditions, and acceptance criteria rather than assuming that every build includes the same tests.
Q6 What files are needed for a Flex PCB quotation and manufacturing review? +
Provide Gerber or ODB++ data, drill files, a stackup, fabrication notes, and quantities. Add the board outline, material and copper requirements, surface finish, coverlay details, stiffener drawings, and bend requirements. For assembly, include the BOM, placement data, and assembly drawings. Highlight special inspection, impedance, or flex-cycle requirements so they can be reviewed in the quotation.

Get Your Custom PCB & PCBA Quote in 24 Hours

Have a new project or custom PCB requirements? Simply fill in your project details below. XinshunPCB’s FAE engineering team will analyze your specifications and deliver a detailed formal quotation along with free engineering advice within 2–24 hours.

24-Hour Fast Turnaround

Detailed formal quote & lead time provided within 2-24 hours.

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Free Engineering Consultation

Experienced FAE support to help optimize your specifications.

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