Multilayer Rigid-Flex
Multiple rigid sub-stacks linked by one or more flex layers, integrating a complete system into a single folding board.
2–32 layers
Custom rigid-flex circuits combine multilayer FR-4 sections with flexible polyimide interconnects to eliminate cables, reduce assembly space, and support reliable 3D packaging. XinshunPCB provides stackup review, bend-zone engineering, controlled impedance, and production support from prototypes to volume builds.
Request a Rigid-Flex PCB QuoteReview construction parameters for rigid-flex builds together with the process and reliability window for rigid sections. Mass-production and extended-prototype limits are shown separately. Contact XinshunPCB to evaluate requirements beyond these ranges.
| Parameter | Specification |
|---|---|
| Rigid-flex total layers | 2–32 layers |
| Flexible layers (within) | 1–12 layers |
| Rigid base material | FR-4 (High-Tg 150 / 170 available) |
| Flex base material | Polyimide (PI / Kapton), PET, PEN |
| Coverlay | Polyimide coverlay on flex areas |
| Stiffeners | FR4, aluminum, polyimide, stainless steel |
| Finished thickness (rigid-flex) | 0.06–4.0 mm (0.0024″–0.16″) |
| Copper weight | Flex 1/3 oz–2 oz · rigid heavy copper to 12 oz |
| Flex-section min trace / space | 0.5 oz: 4/4 mil · 1 oz: 5/5 mil · 2 oz: 5/7 mil |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Min. inner-layer clearance | 3 mil | 3 mil |
| Min. line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Min. hole size | 0.1 mm | 0.1 mm |
| Min. plated hole copper | 25 µm | 25 µm |
| Min. blind / buried via | 0.1 mm | 0.1 mm (1–18 layers) |
| PTH diameter tolerance | ±0.076 mm (±3 mil) | ±0.076 mm (±3 mil) |
| NPTH diameter tolerance | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Hole position deviation | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Heavy copper (rigid) | 4 oz (140 µm) | Up to 12 oz |
| Min. solder-mask bridge | 0.1 mm (4 mil) | 0.1 mm (4 mil) |
| Solder-mask colour | Green, Black, Blue, White, Yellow, Red | Green, Black, Blue, White, Yellow, Red |
| Silkscreen colour | White, Yellow, Red, Black | White, Yellow, Red, Black |
| Peelable mask | Top, bottom, double-sided | Top, bottom, double-sided |
| Parameter | Specification |
|---|---|
| ENIG | Available |
| ENEPIG | Available |
| Immersion Silver / Tin | Available |
| OSP | Available |
| Hard Gold / Gold fingers | Available |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Outline method | Routing, V-groove, beveling, punch | Routing, V-groove, beveling, punch |
| Outline tolerance | ±0.15 mm (±6 mil) | ±0.15 mm (±6 mil) |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | ±10% | ±7% |
| Insulation resistance | 1 × 10¹² Ω (normal) | 1 × 10¹² Ω (normal) |
| Through-hole resistance | < 300 Ω (normal) | < 300 Ω (normal) |
| Thermal shock | 3 × 10 sec @ 288 ℃ | 3 × 10 sec @ 288 ℃ |
| Warp & twist | ≤ 0.7% | ≤ 0.7% |
| Electric strength | > 1.3 kV/mm | > 1.4 kV/mm |
| Peel strength | 1.4 N/mm | 1.4 N/mm |
| Solder-mask abrasion | > 6H | > 6H |
| Flammability | 94V-0 | 94V-0 |
| Test voltage | 50–330 V | 50–330 V |
Send your Gerbers, layer drawing, and bend requirements — XinshunPCB engineers will confirm manufacturability against this specification and reply with a quote, usually within 24 hours, plus a free DFM review.
Request a QuoteConstructions for tight folds, high layer counts, and demanding reliability requirements.
Multiple rigid sub-stacks linked by one or more flex layers, integrating a complete system into a single folding board.
2–32 layersLoose-leaf, book-binding, and unbonded air-gap flex layers support a smaller bend radius and longer flex life.
Tight foldsLaser microvias, stacked or staggered vias, and fine lines in the rigid areas support dense component fan-out.
MicroviaImpedance control is maintained across rigid-to-flex transitions with stackup design and TDR verification.
To ±7%Conductive shielding film over flex areas supports noise-sensitive, high-frequency, and medical designs.
Shielded flexSelective stiffeners and bevelled gold ZIF or contact fingers reinforce connector and component areas.
FR4 · PI · steelRigid-flex spans two worlds, so we build flex and rigid-flex construction to IPC-6013 / IPC-2223 and rigid sections to IPC-6012 — all under one quality system.
Flex & rigid-flex
Flex design specification
Rigid sections
Board acceptability
Assembly Class 2/3
Quality management
Listed
EU compliant
Medical-capable
Auto & aerospace capable
Explore PCB and PCBA solutions where compact three-dimensional integration, reliable interconnection, and resistance to vibration or repeated handling are essential.
Find practical answers about rigid-flex construction, layer counts, material selection, bend requirements, inspection, and the files needed for a Rigid-Flex PCB quotation.
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