Create more routing space for fine-pitch components with laser microvias, via-in-pad structures, and multilayer HDI stackups. XinshunPCB helps align interconnect density, materials, and impedance requirements for compact devices and high-speed electronics.
Request an HDI PCB QuoteReview HDI structures, microvias, and fabrication parameters for your next design. Values below are planning references; the available combination of layer count, copper weight, hole geometry, and tolerances must be confirmed by XinshunPCB during DFM review before ordering.
| Parameter | Specification |
|---|---|
| HDI structures | 1+N+1, 2+N+2, 3+N+3; any-layer subject to review |
| Laser microvia diameter | 0.1 mm (4 mil); finer features require review |
| Microvia capture pad | Design reference: from approximately 0.25 mm |
| Microvia types | Stacked, staggered, and skip vias |
| Via fill | Copper-filled; resin-filled, capped, and planarized (VIPPO) |
| Build-up | Sequential lamination; multiple build-up layers |
| Minimum blind / buried via | Design reference: 0.1 mm within 1–18 layers |
| Through-hole aspect ratio | Design reference: up to approximately 10:1 |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Minimum inner-layer clearance | 3 mil | 3 mil |
| Minimum line width | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Minimum line space | 3 mil (0.075 mm) | 3 mil (0.075 mm) |
| Minimum mechanical hole | 0.1 mm | 0.1 mm |
| Minimum plated hole copper | 25 µm | 25 µm |
| PTH diameter tolerance | ±0.076 mm (±3 mil) | ±0.076 mm (±3 mil) |
| NPTH diameter tolerance | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Hole position deviation | ±0.05 mm (±2 mil) | ±0.05 mm (±2 mil) |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Overall layer count — subject to review | 1–24 layers | 1–78 layers |
| Heavy copper — subject to review | 4 oz (140 µm) | Up to 12 oz |
| Minimum solder-mask bridge | 0.1 mm (4 mil) | 0.1 mm (4 mil) |
| Solder-mask colour | Green, Black, Blue, White, Yellow, Red | Green, Black, Blue, White, Yellow, Red |
| Silkscreen colour | White, Yellow, Red, Black | White, Yellow, Red, Black |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Outline method | Routing, V-groove, beveling, punch | Routing, V-groove, beveling, punch |
| Outline tolerance | ±0.15 mm (±6 mil) | ±0.15 mm (±6 mil) |
| Peelable mask | Top, bottom, double-sided | Top, bottom, double-sided |
| Parameter | Mass production | Prototype (extended) |
|---|---|---|
| Controlled impedance | ±10% | ±7% |
| Insulation resistance | 1 × 10¹² Ω (normal) | 1 × 10¹² Ω (normal) |
| Through-hole resistance — test definition to confirm | < 300 Ω (normal) | < 300 Ω (normal) |
| Thermal shock | 3 × 10 seconds at 288 °C | 3 × 10 seconds at 288 °C |
| Warp & twist | ≤ 0.7% | ≤ 0.7% |
| Electric strength | > 1.3 kV/mm | > 1.4 kV/mm |
| Flammability — material recognition to confirm | 94V-0 | 94V-0 |
| Test voltage | 50–330 V | 50–330 V |
Send your Gerbers, proposed stackup, and via map to XinshunPCB. Our engineers will review the build-up structure, microvia requirements, and manufacturability, then provide a quotation and DFM feedback for your project.
Request an HDI PCB QuoteCombine microvia structures, fine-line routing, and controlled stackups to support miniaturization and high-speed performance. The final process route is reviewed against your design and qualification requirements.
Connections between successive layers can shorten escape routes and free routing space around high-pin-count devices. Select an any-layer structure after reviewing density, layer transitions, and reliability requirements.
Any-layer interconnect
Copper-filled laser microvias can be arranged in stacked or staggered patterns. Match the arrangement to the layer transitions, available pad area, and agreed qualification plan.
Copper-filled microvias
Filled, capped, and planarized vias allow routing connections within component pads. Define the filling and plating requirements to support fine-pitch BGA assembly.
Filled & plated over
Successive build-up and lamination stages connect outer routing layers to the core. Review 1+N+1, 2+N+2, and more complex structures against the required routing density.
HDI build-up
Fine trace geometries help route dense component areas. Select copper thickness and the appropriate imaging and etching process; advanced mSAP requirements need a separate process review.
Fine-pitch routing
Coordinate dielectric materials, trace geometry, and reference planes across the HDI stackup. Define impedance targets and test coupons before releasing the design.
Signal integrityDefine the applicable design, board acceptance, assembly, and quality requirements before production. XinshunPCB reviews the required standard revision, acceptance class, test plan, and certification scope for each HDI project.
HDI design requirements
HDI qualification requirements
Rigid-board performance
Bare-board acceptance
Assembly acceptance criteria
Quality management
Confirm material recognition
Material compliance requirements
Medical quality requirements
Confirm project-specific scope
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Explore SolutionFind practical answers about HDI stackups, microvias, via-in-pad, materials, testing, and the files needed for a manufacturing review.
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