We offer a complete range of in-house surface finishes tailored to specific assembly requirements:
ENIG (Electroless Nickel Immersion Gold): 2–3 µin Au over 120–240 µin Ni. Provides planar pads for fine-pitch BGAs and excellent shelf life (> 12 months).
Lead-Free HASL: Cost-effective, robust solderability for through-hole and standard SMD pitch (> 0.5 mm).
Immersion Silver (IAg) & Immersion Tin (ISn): Flat surface, zero skin-effect loss, optimal for high-speed RF paths and press-fit connectors.
ENEPIG: Adds an electroless palladium barrier (2–4 µin) to prevent "black pad" defects, ideal for gold-wire bonding and multi-cycle reflow.
Hard Gold: 20–50 µin electrolytic gold over nickel for edge connectors, keypads, and sliding contact fingers.

Our CNC mechanical drilling supports minimum drill bit sizes down to 0.15 mm (6 mil) with a finished hole size of 0.10 mm. Utilizing automated Vertical Continuous Plating (VCP) lines, we reliably achieve high aspect ratios up to 12:1 (up to 14:1 on qualified builds) with uniform hole wall copper thickness ≥ 25 µm (1.0 mil). We fully support Via-in-Pad Plated Over (VIPPO / POFV): vias are vacuum-filled with non-conductive epoxy resin, thermally cured, planarized flush with the surface (< 15 µm coplanarity), and copper-capped to allow 0.35 mm to 0.40 mm pitch BGA placement without solder loss.

We produce heavy-copper boards up to 10oz (350 µm) finished copper on both external and internal layers, supporting sustained current loads exceeding 150A. To eliminate resin starvation and delamination between thick copper traces, we utilize high-resin content prepregs (e.g., 1080/2116 HR), optimized multi-step vacuum lamination thermal profiles, and rounded copper conductor corners. For high-voltage designs (> 1000V DC), we implement CNC-routed air isolation creepage slots and perform 100% dielectric Hipot withstand testing (> 3000V AC).

We hold single-ended (50Ω), differential pairs (90Ω, 100Ω), and coplanar waveguide impedance tolerances to ±5% (standard industry baseline is ±10%). Every impedance-controlled job is modeled using Polar SI9000 field solvers to optimize trace geometry against specific dielectric prepreg constants ($D_k$). We route dedicated impedance coupon traces on every production panel break-away rail and conduct 100% verification using Time-Domain Reflectometry (TDR), delivering batch TDR test curves with your shipment.

We fabricate rigid multilayer PCBs from 2 to 32+ layers in-house. We support standard High-TG FR-4 constructions (Shengyi S1000-2M, ITEQ IT-180A, Isola 370HR), ultra-low-loss high-speed substrates (Panasonic Megtron 6/7, Nelco), and high-frequency hybrid stackups (Rogers RO4350B/RO4835 paired with FR-4 cores). Prior to fabrication, our engineering team provides stackup symmetry checks, dielectric thickness optimization, and thermal expansion balancing to ensure board warpage remains strictly < 0.5%.