Empowering global hardware innovators from design feasibility and precision bare board fabrication to high-density SMT assembly, custom box-build, and IPC Class 3 certified fulfillment. XINSHUN bridges the gap between engineering concept and volume production with 100% in-house manufacturing and uncompromising intellectual property protection.
Empowering global hardware innovators from design feasibility and precision bare board fabrication to high-density SMT assembly, custom box-build, and IPC Class 3 certified fulfillment. XINSHUN bridges the gap between engineering concept and volume production with 100% in-house manufacturing and uncompromising intellectual property protection.
Founded in Shenzhen, XINSHUN is a leading high-precision PCB manufacturer and turnkey PCBA provider. Operating a 10,000+ m² facility with ISO 9001, ISO 13485, and UL certifications, we deliver 100% factory-direct quality from quick-turn prototypes to volume production.
Years Industry Experience
m² Production Facility Area
m² Monthly Production Capacity
Hours Quick-Turn Prototype Lead Time
On-Time Delivery Rate
The foundational principles shaping our craftsmanship, engineering accountability, and long-term client partnerships across global mission-critical industries.
From precision bare PCB prototyping to a fully integrated, IPC Class 3 certified global OEM/ODM manufacturing partner. Discover our 15+ year evolution in electronic engineering.
Established manufacturing operations focusing on high-mix double-sided and multilayer rigid circuit boards. Launched our dedicated 24–48 hour quick-turn prototyping service, integrated automated CAM verification workflows, and achieved ISO 9001 quality management compliance to support rapid hardware iterations.
Transformed from pure board fabrication into full-service turnkey PCBA manufacturing. Deployed automated Panasonic and Yamaha SMT placement lines, 10-zone Nitrogen (N2) reflow ovens, and established 100% franchised component procurement channels with Digi-Key, Mouser, and Arrow to guarantee genuine supply chains.
Invested heavily in cutting-edge German LDI laser imaging, UV laser micro-drilling, and proprietary heavy-copper etching. Breakthrough capabilities in Any-Layer HDI (0.075 mm microvias), dynamic rigid-flex circuits, and up to 10oz (350 µm) heavy copper fabrication for mission-critical 1500V power electronics.
Commissioned our 25,000+ m² ISO 7 cleanroom manufacturing facility in Shenzhen. Earned ISO 13485:2016 medical device and UL 94V-0 accreditations. Implemented a multi-tier testing gate—100% 3D SPI, dual-angle 3D AOI, micro-focus 3D X-Ray, and high-voltage Hipot testing—enforcing IPC-A-610 Class 3 zero-defect reliability.
Integrated automated DFM/DFA engineering engines, robotic 4-axis selective conformal coating, and full electro-mechanical box-build assembly. Providing end-to-end hardware solutions for utility-scale 1500V energy storage (BESS), 5G mmWave telecommunications, and diagnostic medical equipment with worldwide door-to-door (DDP) fulfillment.
We bridge the gap between engineering design and flawless manufacturing. From rapid prototyping to full turnkey mass production, explore why leading global hardware developers and OEMs rely on XINSHUN as their long-term manufacturing partner.
Accelerate your time-to-market with our 24-48 hour rapid prototyping service. Backed by a 99.2% on-time delivery rate, we keep your R&D iterations moving without delay.
Enjoy direct manufacturer pricing with zero middleman markup. Our 10,000+ m² modern facility gives us complete control over raw material procurement, lead times, and manufacturing costs.
Prevent costly design revisions before production. Our experienced FAE engineering team performs a 100% free DFM (Design for Manufacturability) and DFA (Design for Assembly) check on all Gerber and BOM files.
Ensure mission-critical reliability with our zero-defect policy. Every board and PCBA assembly undergoes 100% 3D SPI, dual-angle 3D AOI, micro-focus 3D X-Ray inspection for BGAs, and high-voltage Hipot testing to guarantee compliance with IPC-A-610 Class 3 standards.
Strict adherence to international manufacturing benchmarks and quality management systems - fully accredited for medical devices, automotive electronics, high-voltage power systems, and environmental safety standards across 80+ countries.
From rapid NPI prototypes to high-volume production, XinshunPCB provides end-to-end bare board manufacturing. Discover our 6 core circuit board product lines engineered for demanding industrial, medical, automotive, and RF applications.
Concrete, quantitative manufacturing thresholds and factory operational metrics engineered to validate production capacity, process precision, and IPC Class 3 quality execution.
Seamlessly scaling your project from rapid low-volume NPI prototyping to automated, high-volume mass production runs.
Delivering high-precision multilayer rigid PCBs, Any-Layer HDI stackups, and heavy copper boards engineered for IPC Class 3 reliability.
Accelerating your hardware R&D lifecycle with fast-track fabrication, 24-hour factory-direct DFM reviews, and rapid engineering validation.
Partnering with Tier-1 substrate manufacturers, franchised component distributors, and global hardware leaders to deliver zero-defect reliability across 80+ countries.
Have a new project or custom PCB requirements? Simply fill in your project details below. XinshunPCB’s FAE engineering team will analyze your specifications and deliver a detailed formal quotation along with free engineering advice within 2–24 hours.
Detailed formal quote & lead time provided within 2-24 hours.
Your contact info and project specs are kept strictly confidential.
Experienced FAE support to help optimize your specifications.
Need a reliable manufacturing partner for your next project? Our global support team is standing by.
Trusted by global integrators for PCB manufacturing, enterprise hardware, and high-reliability deployment solutions.
